The Global Glass Wafer Carrier Market (ガラスウェーハキャリア市場) is poised for significant growth, expected to reach a valuation of US$ 2.2 billion by 2031, advancing at a remarkable CAGR of 19.2% from 2024. The surge in demand for semiconductors in automotive and IT telecommunications sectors is driving this trend, positioning glass wafer carriers as critical components in semiconductor manufacturing processes.
Analysts indicate that the automotive industry’s increased focus on vehicle safety, security, and advanced technology is further fueling the demand for glass wafer carriers. As the industry shifts towards smarter vehicles equipped with sensors and RF components, the necessity for high-quality semiconductor packaging becomes paramount.
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Market Dynamics
The Glass Wafer Carrier market (Marché des supports de plaquettes de verre) encompasses precisely designed discs made from high-performance glass materials such as borosilicate and alumino-borosilicate, renowned for their thermal stability and transmittance properties. These carriers minimize mechanical stress during critical manufacturing stages, ensuring the integrity of semiconductor wafers. With their ability to withstand high processing temperatures, glass wafer carriers enhance production efficiency while promoting sustainability through multiple reuse cycles.
Key market drivers include:
- High Demand for Semiconductor Packaging: The shift towards wafer-level packaging technology is elevating the use of glass as a carrier substrate, particularly for MEMS (Micro-Electro-Mechanical Systems) and CIS (CMOS Image Sensors).
- Growing Automotive MEMS Applications: The demand for MEMS sensors in automotive applications, such as tire pressure monitoring and rollover detection, is set to increase, enhancing market prospects for glass wafer carriers.
- Borosilicate Glass Adoption: Borosilicate glass currently holds a 48.1% market share, driven by its durability and cost-effectiveness, and is expected to grow at a rate of 20.1% during the forecast period.
Regional Insights
Asia Pacific emerged as the leading region, holding a 43.9% market share in 2023. The region is a global semiconductor manufacturing hub, with significant contributions from China, South Korea, and Japan. The rising disposable income and expanding middle class are expected to further drive demand for consumer electronics and automotive products, thereby bolstering the glass wafer carrier market.
Market Segmentation
Wafer Type
- Quartz
- Silica
- Borosilicate
- Others (Alumino-borosilicate, Alkaline Free Glass, etc.)
Wafer Diameter
- Up to 100mm
- 125mm
- 150mm
- 200mm
- 300mm
- Above 300mm
Application
- Wafer Packaging
- Substrate Carrier
- TGV Interposer
- Glass Circuit Boards
Key Players and Developments
The market is moderately consolidated, featuring notable players such as Absolics Inc., AGC Inc., Corning Incorporated, and SCHOTT AG. Recent developments include:
- SCHOTT Korea commenced the commercialization of glass carrier wafers for semiconductor packaging in January 2023, focusing on advanced technologies such as Fan-Out-Wafer Level Packaging (FO-WLP).
- Corning Incorporated launched ultra-low TTV glass carrier wafers in June 2022, designed to enhance semiconductor manufacturing and support 5G connectivity applications.
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